| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Indentation Rate Response to Enable Property Mapping in Multiphase Solders |
| Author(s) |
Jia-Huei Tien, Lijia Xie, John Blendell, Carol A. Handwerker, David F. Bahr |
| On-Site Speaker (Planned) |
Jia-Huei Tien |
| Abstract Scope |
This study investigates effective methods for measuring mechanical properties, such as hardness, modulus, and creep exponent, of lead-free solder alloys through nanoindentation to allow higher fidelity position identification needed for mapping across microstructural and solder bump scale features. Mapping requires local measurements at relatively high data collection rates, and solders are well known for their strain rate and size-dependent properties. By examining pure Sn and Sn-Bi alloys with nanoindentation using constant strain-rate loading, strain-rate jump testing, and variable hold times, we compare assessed creep and flow behavior, and we use different indenter geometries to achieve different strains for developing constitutive models. Comparing effective modulus results at a wide variety of strain rates enables normalization of loading conditions, allowing higher throughput experiments. Post-indentation imaging was used to identify different possible deformation mechanisms, particularly noting when grain boundary sliding played a significant role in the overall deformation behavior. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Electronic Materials, Characterization |