| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Electromigration Test of Electroless Copper Plating Interconnection |
| Author(s) |
Chun-Yung Hung, Yu-Chun Lin, Min-Yan Tsai, Yun-Ching Hung, C.R. Kao |
| On-Site Speaker (Planned) |
Chun-Yung Hung |
| Abstract Scope |
Electroless copper plating is a potential candidate for achieving low process temperature and pressureless chip interconnection. However, as bump size keeps scaling down, electromigration (EM) becomes a crucial reliability issue. In this research, the EM test is conducted to validate the reliability of electroless copper plating interconnection. There will be two different magnitudes of current in the EM test, allowing the difference to be stated. Kelvin structure test vehicles are designed to measure the resistance of a single bump, and the EM lifetime can also be obtained. In addition, the failure mechanism will be determined by analyzing the cross-sectional images. These results provide a reliability verification of this process, which is beneficial for the future development. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, |