| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Impact of Cryogenic Thermal Cycling on Solder Interconnect Mechanical Stability |
| Author(s) |
Ande Kitamura, Yujin Park, Gnyaneshwar Ramakrishna, Tae-Kyu Lee |
| On-Site Speaker (Planned) |
Tae-Kyu Lee |
| Abstract Scope |
The mechanical stability of Sn based solder material under cryogenic temperature environment is investigated. The recent technology development in quantum computing and electronics in space exploration brought the interest of sub-zero and cryogenic temperature impact on Sn based solder joint performance. Along with isothermal aging at sub-zero and cryogenic temperatures, the possible degradation mechanism during thermal cycling from cryogenic temperature to room temperature with two different temperature ranges are selected and applied to identify the impact of the Sn-alpha to beta transition on solder interconnect stability. Sn-1Ag-0.5Cu (wt%) (SAC105) solder joints were subjected to shear testing after -196°C to room temperature and -196°C to 0°C cryogenic thermal cycling (CTC). The residual stress level per test condition was observed via EBSD stress analysis. A higher residual stress level was observed after CTC, which induce dynamic recrystallization during shear testing. |
| Proceedings Inclusion? |
Planned: |