| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Unveiling the Influence of Interfacial Microstructures on the Evolutions of Interfacial Strength and Electric Resistance of Lamellar Cu/Al/Cu Composites Fabricated by Ultrasonic Welding |
| Author(s) |
Jheyu Lin, Zi-Yuan Liu |
| On-Site Speaker (Planned) |
Jheyu Lin |
| Abstract Scope |
In this study, we employed ultrasonic welding (USW) to join copper and aluminum foils, commonly used in electric vehicle battery modules, as an alternative to laser welding. We evaluated interfacial strength through T-peel tests and sequentially analyzed interfacial microstructures. Samples that underwent higher nominal welding forces demonstrated the presence of thin, continuous intermetallic compounds (IMCs), particularly at the upper 1/2-interface interface compared to the lower 2/3-interface. Phase analysis using X-ray diffraction (XRD) and energy-dispersive spectroscopy (EDS) confirmed the presence of Al2Cu and Al4Cu9. Thin, continuous IMCs were found to be associated with enhanced joint strength, while voids within IMCs were correlated with reduced strength. We also investigated electrical properties, noting an initial high resistivity due to the presence of un-bonded sections, followed by a decrease in resistivity from bonding formation and a subsequent increase in resistivity associated with significant IMC growth at the interface. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Aluminum, Joining |