About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications XI
|
Presentation Title |
C-6: Minor Cu Addition in β-Zn4Sb3 Leads to High Thermoelectric Performance via Phase Diagram Engineering |
Author(s) |
I-Lun Jen, You-Kai Su, Hsin-Jay Wu |
On-Site Speaker (Planned) |
I-Lun Jen |
Abstract Scope |
Thermoelectric (TE) materials have attracted growing attention in recent decades. The p-type β-Zn4Sb3 has been an ideal candidate for mid-temperature TE generator, as it composes of cost-effective and environmental-friend elements. Even though β-Zn4Sb3 is known as a phonon-glass electron-crystal (PGEC) feature, the binary compound alloys face a barrier of thermal instability arising from the highly mobile zinc cations. Additionally, Phase Diagram Engineering is a useful method for determining the solubility range of Cu. In this work, a Zn-Sb-Cu system with a 623 K isothermal section is built. The greatest solubility in Zn4Sb3 at 623 K is less than 4% Cu. As a result, the Cu-addition (Zn4Sb3)1-yCuy alloys are created, and the improved power factor S2ρ-1 ~1.15 (mW/mk2) allows the alloy to reach a figure of merit zT of 0.97 at 623 K. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Other, Other |