| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
2024 Technical Division Student Poster Contest
|
| Presentation Title |
SPG-22: 3D Printed Stretchable Soft Electronics with Metamaterials-inspired Electromagnetic Architecture |
| Author(s) |
LeiBin Li, Dwipak Sahu, Jared Anklam, Samuel Hales, Samannoy Ghosh, Yong Lin Kong |
| On-Site Speaker (Planned) |
LeiBin Li |
| Abstract Scope |
The integration of electronics with soft and stretchable materials can enable active functionalities on the otherwise passive constructs. Previous works have demonstrated exciting success in imparting stretchability with geometrical designs but often require challenging microfabrication processes. Here, we propose a 3D printing approach that can create freeform electronics by selectively annealing micro-extruded nanomaterials in situ using a metamaterials-inspired electromagnetic architecture. This enables the creation of microscale three-dimensional interconnects and electronics with a desktop-sized platform that can resist strain and flexing – allowing the integration of stretchable active components on a soft substrate. We are also studying the integration of printed electronics into a broad range of soft materials by leveraging soft matter physics phenomena. Overall, we envision that this approach can enable new fabrication methodologies that lead to strategies that not only improve device compatibility and durability but also enable new classes of 3D-printed soft electronics. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Additive Manufacturing, Nanotechnology, Polymers |