| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
100 Years and Still Cracking: A Griffith Fracture Symposium
|
| Presentation Title |
Fracture-based Reuse of Single Crystal Wafers for High-Efficiency Photovoltaics |
| Author(s) |
Jie Chen, Corinne E. Packard |
| On-Site Speaker (Planned) |
Jie Chen |
| Abstract Scope |
The spalling of a substrate is usually considered a detrimental phenomenon, where brittle fracture is induced by a tensile-stressed coating causing the critical strain energy release rate of the substrate to be exceeded. Intentional spalling in a process called ‘controlled spalling’ carefully engineers the initiation and propagation of brittle fracture to exfoliate layers of single crystal material to create flexible electronic devices or enable reuse of the substrate. Proof-of-principle device demonstrations have been achieved at wafer scale and in multiple configurations, showing no loss of performance compared to conventionally processed devices while preserving the wafer for reuse, reclaim, or recycling for cost and material savings. This review summarizes advances in controlled spalling as it relates specifically to III-V solar cells, covering advances in spalling-related methods development, process modeling and control, fracture surface morphology, and device processing and performance. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Electronic Materials, |