| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
2025 Technical Division Student Poster Contest
|
| Presentation Title |
SPG-18: High-Reliability Cu-to-Cu Interconnections: IMC-Free TLP Bonding via Gallium Electroplating |
| Author(s) |
Tzu-Hsuan Huang, Shih-kang Lin |
| On-Site Speaker (Planned) |
Tzu-Hsuan Huang |
| Abstract Scope |
Driven by the goal of achieving net-zero carbon dioxide emissions by 2050, the market size of electric vehicles has been growing rapidly in recent years. However, the application of electronic packaging in electric vehicles faces thermal reliability issues due to the high operating temperature. The traditional soldering process encounters significant challenges because of intermetallic compound (IMC) growth, which leads to reduced mechanical properties in real applications. In our research, we focused on IMC-free TLP bonding based on gallium for Cu-to-Cu interconnection. The gallium electroplating process and the theory of fabricating an IMC-free joint based on the phase diagram will be illustrated in our presentation. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Joining, |