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Meeting 2025 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
Presentation Title Advanced characterization and analysis for improved stable material structures
Author(s) Roland Brunner
On-Site Speaker (Planned) Roland Brunner
Abstract Scope Phase stability in microelectronic materials is highly linked to defect formation and possible device break-down. Here, in this talk we review our recent results. We show, how the utilization of ML-supported experimental characterization and analysis combined with modeling methods helps to provide an enhanced understanding. Nanocrystalline thin films show highly attractive material properties, such as high hardness, strength and wear resistance. However, a big drawback concerns the emerging large residual stresses that result from their fabrication by deposition. One solution, is to stabilize the nanocrystalline structure by alloying with a minority element. example concerns Sn – 3.0 wt.% Ag – 0.5 wt.% Cu (SAC305) solder alloys. The predominant fatigue mechanism in SAC305 solders is intergranular fatigue cracking. One approach to enhancing fatigue strength in SAC305 is adding Bi to the alloy, which acts as a solid solution strengthener, increasing its yield strength and hence delaying recrystallisation and subsequent intergranular cracking.
Proceedings Inclusion? Planned:
Keywords Machine Learning, Characterization, Electronic Materials

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Advanced characterization and analysis for improved stable material structures
Advanced Materials for Optimized and phase change based Sustainable Thermal Management Solutions
Bonding mechanism for Cu/SiO2 hybrid joints
Computational simulation of interfacial bonding behavior with various grain structures in Cu-Cu bonding
Effect of Copper Grain Size on Interfacial Reactions of Copper/Solder/Copper sandwiched joints
Effect of Interfacial Microstructure on Mechanical and Electrical Properties in Ultrasonically-Welded Ni/Al/Ni Lamellar Structure
Elastin-like recombinamer-mediated hierarchical mineralization coatings on Zr-16Nb-xTi (x = 4,16 wt%) alloy surfaces improve biocompatibility
Electrochemical Evaluation of Plating Parameters in Anomalous Codeposition Behavior of Invar Electroplating
Electrodeposited gallium for Cu-to-Cu interconnection
Exploring Low-Temperature Soldering with Good Soldering Strength: Investigating Soldering Behavior
Exploring solder wetting angle by using machine learning approach
Fabrication and properties of nanotwinned copper doped with carbon nanotubes by electrodeposition
Flux-Less Solder Ball Attachment Technology (FLAT) for Advanced BGA Assembly
Growth of Cu6Sn5 in a Cu/Sn/Cu micro-joint with a TFMG/Cu dual diffusion barrier layer during thermocompression bonding
High-strength and High-conductivity Nanotwinned Copper Foils via Cu-Ni Co-Electrodeposition
In-situ Characterization of Electrical Current Induced Structural Changes in Single-Phase η-Cu6Sn5 Using Synchrotron Radiation
Interfacial reactions between Sn-based solders and FeCoNiCrMn high-entropy alloy
Joint Properties of Ni-less Surface Finish / Sn-Alloy Solder Using Laser-Assisted Bonding (LAB) Technique
Li and Na interaction in intercalation materials
Liquid-solid interfacial Reactions between lead-free Solders and Cu-6.01wt.% Sn-0.12wt.%P alloy (C5191)
Liquidus and invariant reaction temperatures of Sn-In-Ni-Zn alloys
Liquidus projection and invariant reactions of Bi-Cu-Sn system
Liquidus projections and invariant reactions in the Bi-Cu-Sn-Te quaternary system
Liquid/Solid Interfacial Reactions between the Sn Solder and Cu-Fe Alloy (C194) with the Ni Plating Layer
Microstructure evolution and growth behavior of intermetallic compound between Cu and Sn-Ag alloys
Microstructure Evolution and Phase Transformation of Ni-Sn Compounds after Long-Term Storage
Microstructures of Ag-In transient liquid phase bonding using In-coated Ag sheet
Orientation Effects on the Electrically Induced Phase Transformation in Zirconia
Phase equilibria, solidification and properties of Al-Cu-Ni-Sn alloys
Simulation of polycrystalline microstructure formation in thin film for nanoscale device using phase-field method
Sn-Zn-Bi Low-Melting Alloy with Great Aging Resistance and Wettability
Solid Solution of Multiple Components in Bismuth Rhombohedral Phase
Solid/Solid Interfacial Reactions between Lead-free Solders and Cu-Ni-Si-Mg (C7025) Substrate
Striped Strain-Induced Coherency Loss Leading to Metastable Nanoprecipitate Phase Transformation in Al-Zn-Mg Alloys
Synergistic inhibition effect of nitrides and metal ions on corrosion of copper
The effect of temperature on the microstructure, lattice, mechanical and electrical properties of Sn-Bi alloys
Tuning topotactic transformations in vanadium oxide thin films for microbolometer applications

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