| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior at the Nanoscale V
|
| Presentation Title |
Grain Size Effect on Thin Film Adhesion |
| Author(s) |
Alice Lassnig |
| On-Site Speaker (Planned) |
Alice Lassnig |
| Abstract Scope |
Thin film adhesion is a crucial measure to determine the reliability of a thin film – substrate materials system. In the following study we investigated the role of film grain size of sputtered Cu films deposited on glass substrates, as a model material system. While maintaining residual stresses, interface chemistry, and film thickness comparable, the film microstructures were varied by means of different sputtering parameters as well as isothermal annealing after deposition. Highly compressively stressed Mo overlayers were used to cause delamination of the thin films from the substrates allowing to quantify thin film adhesion using the Hutchinson & Suo model. It could be shown that the thin films with smaller grains revealed improved adhesion compared to their large grained counterparts. Furthermore, an in-situ TEM crack propagation study was conducted to visualize the crack-grain boundary interaction between the thin film and the substrate material. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |