| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior Related to Interface Physics IV
|
| Presentation Title |
Thin film adhesion measurement with micro-scale bulge tester |
| Author(s) |
Stanislav Zak |
| On-Site Speaker (Planned) |
Stanislav Zak |
| Abstract Scope |
The measurement of thin film/coating adhesion on a substrate is becoming more important with increasing demand for multilayered applications in modern electronic, medical and aero-space industry. Knowledge on real adhesion energies for different material systems is necessary to be able to ensure long-life reliability of the devices, where delamination is the main failure mechanism. There are several methods to measure adhesion energy from purely qualitative peel tests to quantitative methods with use of e.g. nanoindentation scratching or spontaneous buckling. As a complimentary method, the bulge testing (on a micro-scale) can be adapted to provide additional method measuring the thin film delamination under various conditions, instead of a standard elastic modulus measurement. This work presents the experimental technique of bulge testing combined with numerical modelling to evaluate thin film adhesion energy together with the loading modes at the tip of the delamination crack. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Modeling and Simulation, Thin Films and Interfaces |