| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Contribution of Ni Microalloying to the Cu Dissolution of In-35Sn/Cu Solder Joint After Multiple Reflows |
| Author(s) |
Mohd Arif Anuar Salleh, Chang May Shin, Kazuhiro Nogita, Hideyuki Yasuda |
| On-Site Speaker (Planned) |
Mohd Arif Anuar Salleh |
| Abstract Scope |
The primary IMC particles growth in the In-35Sn solder melt during solidification when subjected to multiple reflow process on Cu was visualized by in-situ real-time synchrotron radiography imaging. Multiple reflow soldering caused the primary Cu(In,Sn)2 and interfacial Cu3(Sn,In) layer in the In-35Sn grain coarsened. The Ni element was presence in the primary (Cu,Ni)1(In,Sn)2 particles and interfacial (Cu,Ni)3(Sn,In) layer caused grain size refinement to the IMCs after multiple reflow soldering. The shear test showed that there was a minor increase in shear force after multiple reflows. However, the shear energy decreased, indicating a more notable decrease in displacement to fracture rather than shear force. The ductile fracture indicated that the thickness and morphology of the interfacial IMC is not significantly impact on the shear strength of the solder joints. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Characterization, Electronic Materials |