About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection Materials II
|
Presentation Title |
Advanced Vapor Chamber with Enhanced Hierarchical Dendritic Wick Structure for High-power-devices |
Author(s) |
Chao-Yang Chiang, Jui-Cheng Yu, En-Chia Liu, Po-Hsun He, Yu-Hsiang Chang, Hung-Hsien Huang, Chen-Chao Wang, Chih-Pin Hung, Chien-Neng Liao |
On-Site Speaker (Planned) |
Chao-Yang Chiang |
Abstract Scope |
The rapid advancement of technology has significantly increased the demand for high-performance electronic components. A vapor chamber (VC) requires a metal casing, working fluid, and an internal capillary wick structure to facilitate fluid circulation. The maximum heat transfer rate of a VC generally depends on the liquid permeability (K) and capillary pressure (ΔP) of the wick structure, which is rarely achieved in homogeneous porous structures. In this study, we prepared a hierarchical dendritic copper wick using one-step electrodeposition and post-deposition sintering process, achieving large K and ΔP values simultaneously. Furthermore, we optimized the thickness and morphology of the dendritic wick structure applied to the evaporator of the VC, as well as the working fluid filling ratio, achieving an optimized total thermal resistance of 0.056 K/W and a maximum heat transfer capacity of 800 watts, demonstrating a distinct high-power thermal management application. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Thin Films and Interfaces, Surface Modification and Coatings |