| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing: Advanced Functional Materials, Processing Concepts, and Emerging Applications
|
| Presentation Title |
Direct-Write of High Conductivity Metal Interconnects and Micro-Bumps via Confined Electrochemical Deposition |
| Author(s) |
Majid Minary |
| On-Site Speaker (Planned) |
Majid Minary |
| Abstract Scope |
Flexible hybrid electronics require high-conductivity metal interconnects and high-resolution features for high-density interconnects and heterogeneous integration. Over the past decade, we have developed an electrochemical deposition (electroplating) technology that enables direct-write printing of metals with conductivity close to bulk values. This method allows processing at room temperature without high-temperature post-processing, making it compatible with flexible polymeric and rigid substrates. We achieve linewidths and bump diameters down to a few microns. The printed films have sub-micron thickness and smooth surfaces (below 20 nm roughness) with excellent adhesion. By controlling electroplating parameters (DC and pulse), we can manage microstructure and grain size, resulting in low-impurity printed structures. These properties yield mechanical and electrical characteristics close to bulk metal without apparent porosity. Additionally, we have developed multi-physics models to understand the printing process and its governing parameters. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Electronic Materials, Thin Films and Interfaces |