| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Microstructure Evolution and Interfacial Growth of Intermetallic Compound for Cu/In/Cu Structure under Thermomigration |
| Author(s) |
Chen-Wei Lee, Jou Hsuan Lee, Fan-Yi Ouyang |
| On-Site Speaker (Planned) |
Chen-Wei Lee |
| Abstract Scope |
In response to the scaling and higher performance of integrated circuit, electronic industry is introducing the so-called 3D IC technology. In order to reduce the thermal damage during high-temperature fabrication in 3D ICs, solid-liquid interdiffusion bonding and hot pressing in low-temperature bonding technology have gradually attracted attention. Because the diameter of microbumps in 3D IC is usually below 20 um, it is easy to establish a large temperature gradient, and induces the intermetallic compound to grow asymmetrically during the reflow process. In addition, Indium has been used well as a bonding solder because of its low melting point. Therefore, in this study, a copper/indium/copper symmetrical structure was used to understand the copper-indium interfacial reaction and the growth of copper-indium intermetallic compounds during reflow at 220 °C and to understand the diffusion behavior caused by the temperature gradient and the related dynamic mechanism |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |