| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Thin Films and Coatings: Properties, Processing and Applications
|
| Presentation Title |
Reactive Multilayer Induced Self-Healing in Thin Films – The Importance of Diffusion Barriers |
| Author(s) |
Nensi Toncich, Patricia Moll, Kristian Skailand, Ralph Spolenak |
| On-Site Speaker (Planned) |
Nensi Toncich |
| Abstract Scope |
Reactive Ni/Al multilayers offer potential as heat sources for on-chip self-healing via on-demand localized thin film welding. They are effective in healing cracks up to 500 nm in gold and copper films. However, interdiffusion between the thin film and the heat source reduces performance compared to pristine film. To address this, a non-reactive diffusion barrier is introduced between the multilayers and the to-be-healed film to prevent contamination, thereby optimizing electrical performance post-healing in microelectronic applications. This work investigates tungsten- and ruthenium-based barriers which show promise under the extreme thermal and mechanical stresses induced by reaction temperatures reaching around 1500 °C within milliseconds. Additionally, maintaining strong adhesion and good wetting between the diffusion barrier and the layer to be healed is crucial for effective healing. We highlight key parameters for optimizing barrier functionality and provide insights to future diffusion barrier design, ultimately enhancing the durability of microelectronic devices. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Other, Other |