| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Bonding and High-temperature Storage Performance of Die Attachment with Ag Paste Sintering on Bare Direct Bonding Aluminum (DBA) Substrate |
| Author(s) |
Zheng Zhang, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma |
| On-Site Speaker (Planned) |
Zheng Zhang |
| Abstract Scope |
Sintering Ag paste is an important interconnection technique for power electronics due to its low-temperature sinter-ability, high-temperature stability, and high thermal and electrical conductivity. To get a reliable die attach via sintering Ag paste, it is required substrates to get a metallization layer for matching the Ag sintering process, which allows Ag bond with metallization layer via interdiffusion process. However, the metallization layer requires noble metals such as Ag or Au, which will inevitably increase the cost. In this work, we report a robust Ag sinter joining on bare DBA substrate, one of the mostly used substrates in power electronics, and whole sintering processes are accomplished at a pressureless, low-temperature, and atmospheric condition. The bonding mechanism is discussed in detail. In addition, high-temperature storage performance of the die attach specimens is investigated by 250 °C storage up to 1000 hours. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |