| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Transformations and Microstructural Evolution
|
| Presentation Title |
Controlling intermetallic precipitation in Cu-Ti alloys to tune mechanical and electrical properties |
| Author(s) |
Rohit Berlia, Michael Wall, Todd Hufnagel, Timothy Weihs |
| On-Site Speaker (Planned) |
Rohit Berlia |
| Abstract Scope |
Cu-Ti alloys possess an excellent combination of high strength and high conductivity compared to other Cu alloys. These properties are significantly affected by microstructural evolution of the Cu4Ti precipitates which depend on Ti concentration and thermal processing conditions. In this work, we investigate microstructural evolution in 200 microns thick freestanding sputter deposited Cu-Ti foils with compositions varying from Cu-1at% Ti to Cu-10at% Ti and identify compositions and processing conditions that optimize both strength and conductivity. All samples were homogenized above solvus temperatures, quenched, and then aged between 400oC and 550oC to obtain a wide variation in the Cu4Ti precipitate size and volume fraction and potentially variations in the Cu4Ti crystal structure (tetragonal vs orthorhombic). Precipitate nucleation and growth are studied using transmission X-ray diffraction and electron microscopy, and are complemented by electrical resistivity measurements and nanoindentation. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, Copper / Nickel / Cobalt, Mechanical Properties |