| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
A New Method for High Precision Work of Adhesion Measurements of Micron-Scale Copper Bonds |
| Author(s) |
Alex Wang, Carl Thompson, Cemal Cem Tasan |
| On-Site Speaker (Planned) |
Alex Wang |
| Abstract Scope |
High precision measurements of metallic bond strengths are critical as modern advances in packaging of heterogeneously integrated microelectronic circuits require thermocompression pillar bonds and hybrid bonds at finer and finer pitches. An in-situ SEM tensile and compression stage was adapted for measurements of the work of adhesion using a wedge insertion technique. The new stage allows for in situ alignment between the wedge and the samples with sub-micron precision for microscopic observation of the debonding process. Displacement rates down to 0.05 mm/s can be measured while applying a force up to 2000 N, with 0.02 N resolution. Accurate measurements of adhesive strength for nominally identical groups of micron-sized copper pillars were made. Comparisons of adhesive strength for bonds made using different processes and with different bond pitches are also underway. These capabilities will give insight into reliability-aware process development as well as design of bond configurations that optimize reliability. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Mechanical Properties, Other |