| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Innovative Graphene Coated Cu Powder for Sintering in Air Atmosphere
|
| Author(s) |
Seoyeong Lee, Minsu Kim, Sangwoo Ryu |
| On-Site Speaker (Planned) |
Seoyeong Lee |
| Abstract Scope |
The Cu sinter paste for die attach of wide bandgap semiconductor has received attention due to its higher thermal conductivity and lower cost compared with Ag sinter paste. However, Cu has the issue of being easily oxidized in the atmosphere, thus an inert or reducing atmosphere is required for the sintering process, resulting in increase of process cost. In this study, a graphene coating layer was adopted on the surface of Cu particle to address its oxidation problem. The graphene coating layer was deposited on the Cu micro-sized particle using the bottom-up assembly of carbon atoms by the dehydration from the hydrocarbon precursor. The graphene covered Cu particle and nanosized Ag particle were mixed with solvent for the sinter paste formulation. The sintering process was conducted in air atmosphere with the various sintering conditions. The shear strength and microstructure of sintered joint were investigated. |
| Proceedings Inclusion? |
Planned: |