| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Solid/Solid Interfacial Reactions Between Lead-Free Solders and Cu-Ni-Si-Mg (C7025) Substrate |
| Author(s) |
Ting Chen, Jing-Ting Chou, Yee-Wen Yen |
| On-Site Speaker (Planned) |
Ting Chen |
| Abstract Scope |
The solid/solid reaction couple technique was employed to investigate the interfacial reactions between the Cu-3.0 wt.% Ni-0.65 wt.% Si-0.15 wt.% Mg (C7025) substrate and lead-free solders (LFS)-Sn, and Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) at 125, 150, and 175°C for 96 to 1536 h. The η'-Cu6Sn5 phase near the solder and the (Cu, Ni)6Sn5 phase close to C7025 substrate were formed in all couples. No Cu3Sn phase was found at the LFS/C7025 interface. The thickness of the intermetallic compounds (IMCs) increased with the increase in the reaction times and temperatures. However, the thicker IMC layer was observed in the SAC/C7025 couple. The cracks observed at the LFS/C7025 interface due to the mismatch in the coefficient of thermal expansion between the (Cu, Ni)6Sn5 phase and C7025 substrate. Meanwhile, the cracks were observed among the η'-Cu6Sn5 phases attributed to the stress from the IMC growth. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Phase Transformations, Other |