About this Abstract |
Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
Symposium
|
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
Presentation Title |
Confined Direct Two-phase Jet Impingement Cooling with Topology Optimized Surface Engineering and Phase Separation Using Additive Manufacturing |
Author(s) |
Harish Kumar Lattupalli, Md Asif Iqbal, Emily Cyr, Sina Ghadi, Scott Schiffres |
On-Site Speaker (Planned) |
Scott Schiffres |
Abstract Scope |
As cloud computing's role expands, data center energy consumption, especially for cooling, becomes a significant challenge. This project aims to develop an energy-efficient two-phase cooling system for data centers, targeting less than 5% of total energy use for cooling and eliminating water consumption. We propose a novel two-phase wick structure with thermal resistance below 0.01 K/W, directly printed on chips without thermal interface materials using an innovative inter-material. Topology optimization of the heatsink design enhances cooling for high-power chips, crucial for AI applications. We've optimized wick porosity and microstructure through process development studies, validated by using SEM, optical microscopy, and CT-scan. An optimized manifold design using vat polymerization ensures uniform flow distribution. Test artifacts with varied dimensions and material compatibility tests were fabricated to finalize design parameters and identify optimal coolant materials. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |