About this Abstract |
Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
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Symposium
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2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
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Presentation Title |
Investigating the Effects of Thermal Post-processing Parameters on Interfacial Delamination of Bimetallic 3D Printed Parts |
Author(s) |
Erik H. Inman, Chaitanya Mahajan, Srikanthan Ramesh |
On-Site Speaker (Planned) |
Erik H. Inman |
Abstract Scope |
The rise of heated metal filament extrusion 3D printing has simplified on demand production of unique and supply chain restricted parts. This process involves layer-by-layer material deposition to produce a 3D part, which is then thermally debound, leaving a porous metal part. A secondary thermal sintering heat cycle is then used to create a solid, finished product. While this process is readily deployable, the concept of bimetallic printing presents an opportunity for innovation. Bimetallic Copper (Cu) and Stainless Steel (SS 316L) parts can be produced using a dual extrusion system. One of the challenges in printing bimetallic parts that this study seeks to address is interfacial delamination during thermal sintering. The study intends to develop predictable and functional sintering parameters of Cu/SS 316L bimetallic 3D printed parts. Material coalescence and the delamination interface will be characterized with X-ray diffraction (XRD), scanning electron microscopy (SEM), and microcomputed tomography (Micro CT) equipment. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |