| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Temperature and Strain Rate Dependence of Mechanical Properties in Sn-Bi Alloys |
| Author(s) |
Kazuhiro Nogita, Xin Fu Tan, Xiaozhou Ye , Kazuhiro Yasuda, Stuart McDonald |
| On-Site Speaker (Planned) |
Kazuhiro Nogita |
| Abstract Scope |
We have previously reported that the mechanical properties of Sn-Bi low temperature solder alloys are strain rate dependent and there is a power law relationship between tensile strength and strain rate at room temperature. Furthermore, the extremely ductile behaviour of Sn-Bi alloys at low strain rates undergoes a transition to a brittle failure mode as the strain rate increases in a range where the ductility of conventional solder alloys is not compromised. These observations are likely related to the fine eutectic microstructure, low melting point and solute strengthening of Sn associated with Bi additions, however, the underlying mechanisms are still under debate. This presentation provides an overview of the relationship between temperature, mechanical properties, microstructure and fracture mode in Sn-Bi solders. Temperature controlled in-situ tensile testing in a high voltage transmission electron microscopy (HV-TEM) is used to provide further insights into the behaviour of these alloys. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Characterization, |