| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Liquid/Solid Interfacial Reactions Between the Sn Solder and Cu-Fe Alloy (C194) with the Ni Plating Layer |
| Author(s) |
Ssu-Chen Pan, Yu-Cheng Jhen, Yee-Wen Yen |
| On-Site Speaker (Planned) |
Ssu-Chen Pan |
| Abstract Scope |
The Cu-2.35Fe-0.07P-0.12Zn (in wt.%) alloy (C194) is suitable to be used as the lead frame material and the Ni layer was widely used as the diffusion barrier in the electronic packaging industry. The Ni layers with the 1, 3, and 5 μm thickness were electroplated on the C194. The interfacial reactions in the Sn/Ni/C194 couples were reacted at 240, 255, and 270°C for 30 to 480 s. The results shows at when the Ni layer was remained at the interface, the (Ni,Cu)3Sn4 was observed at the interface. When the Ni layer was completely consumed, the (Ni,Cu)3Sn4 was transferred the (Cu,Ni)6Sn5 phase at the interface. The thickness of the intermetallic compounds (IMCs) increased with the increase in the reaction times and temperatures. For the inhibition of the Cu atoms diffusion to the Sn side, the optimal thickness of the Ni layer is 3 μm for the Sn/Ni/C194 couple. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, Electronic Materials, Other |