| About this Abstract |
| Meeting |
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
| Symposium
|
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
| Presentation Title |
Welding of Aluminum in Chip Extrusion |
| Author(s) |
André Schulze, Oliver Hering, A. Erman Tekkaya |
| On-Site Speaker (Planned) |
André Schulze |
| Abstract Scope |
The reduction of energy consumption and CO2 emissions in the aluminum profile production can be achieved by solid state recycling. By direct hot extrusion, aluminum chips can be directly processed into semi-finished or near-netshape products requiring relatively low energy and having a high material yield. Since the mechanical properties of the extruded profiles highly depend on the welding of the individual chips, the main focus is to achieve a sufficient bonding between the chips. For this, the oxide layer covering the aluminum surface has to be broken. In order to predict the welding of the individual chips and estimate the process success a weld prediction model is developed. The influence of process parameters such as extrusion ratio, temperature and speed is analysed. The weld model is applied to further profiles and validated by experimental tryouts. |
| Proceedings Inclusion? |
Definite: At-meeting proceedings |