| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
New Insights Into the Role of Microstructure on the Thermal Fatigue Performance of BGA Packages |
| Author(s) |
Christopher M. Gourlay, Jingwei Xian, Yilun Xu, Richard J. Coyle, Fionn Dunne |
| On-Site Speaker (Planned) |
Christopher M. Gourlay |
| Abstract Scope |
Pb-free solders commonly fail by thermal fatigue due to temperature fluctuations experienced during operation. Previous work has shown that failure does not always occur in the joints with the highest thermal strain per cycle, and that the joint microstructure also plays an important role. Here we study the effects of initial solder microstructure on the development of thermal fatigue damage. We focus on tin orientation(s) and the intermetallic length scale and consider single grain versus multi-grain joints as well as beachball versus interlaced joints. The findings allow recommendations to be made on the optimum microstructures for thermal fatigue resistance. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, |