| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
2024 Technical Division Student Poster Contest
|
| Presentation Title |
SPG-14: Liquid/Solid Interfacial Reactions between Lead-free Solders and the Cu-Ni-Si-Mg Alloy(C7025) |
| Author(s) |
Jing-ting Chou, Yi-chin Liou, Yee-wen Yen |
| On-Site Speaker (Planned) |
Jing-ting Chou |
| Abstract Scope |
Liquid/solid interfacial reactions between three types of lead-free solders including Sn, Sn-3.0 wt%Ag-0.5 wt%Cu, and Sn-0.7 wt%Cu and the C7025 alloy(Cu-3.0 wt%Ni-0.65 wt%Si-0.15 wt%Mg) were investigated in this study. Interfacial reactions were studied by using reaction couple technique at temperatures of 240, 255, and 270°C with reaction times ranging from 0.5 to 20 h. The results revealed that with a reaction temperature of 240°C and reaction times of 0.5-5 h, only the (Cu,Ni)6Sn5 phase was formed at the Sn/C7025 reaction couple interfaces. The Cu3Sn phase was observed only after reaction times of 10 h at 240°C, 10 h at 255°C, and 5 h at 270°C in the Sn/C7025 couples. It is noteworthy that the Cu3Sn phase could be observed after 2 hours of reaction at 270°C in the SAC/C7025 and SC/C7025 reaction couples. The intermetallic compound layer became thicker with time and temperature and showed a diffusion-controlled growth mechanism. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Joining, Electronic Materials, Other |