| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Additive Manufacturing and Alloy Design: Bridging Fundamental Physical Metallurgy, Advanced Characterization Techniques, and Integrated Computational Materials Engineering for Advanced Materials
|
| Presentation Title |
Microstructure, Mechanical Properties, and Conductivity of CuNiSi Alloy Fabricated by Laser Powder Bed Fusion |
| Author(s) |
Siyu Sun, Simon Ringer, Keita Nomoto |
| On-Site Speaker (Planned) |
Siyu Sun |
| Abstract Scope |
Copper and its alloys are widely used due to their excellent electrical and thermal conductivity, corrosion resistance, and mechanical properties. CuNiSi alloys are particularly notable for their corrosion resistance, stress relaxation resistance and cost-effectiveness, making them suitable for marine and chemical plant applications.
Traditional methods for producing CuNiSi alloys, such as casting and sintering, are complex and costly, often requiring extensive tooling and lengthy processing times. Moreover, there are no commercially available electrical grade copper alloys are optimised produced laser powder bed fusion (L-PBF). This project addresses this gap by optimising powder composition, printing parameters, and post-heat treatments to produce high-performance CuNiSi components via L-PBF, aiming to achieve an optimal balance between strength and conductivity. We investigate the microstructure-property relationships using multi-scale microscopy and microanalysis techniques, demonstrating the feasibility and advantages of additive manufacturing for creating efficient and complex-shaped electrical contacts. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Copper / Nickel / Cobalt, |