About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
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Additive Manufacturing: Process-induced Microstructures and Defects
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Presentation Title |
F-42: Investigating the Relationship between Interfacial Microstructure and Joint Strength in Ultrasonically-Welded Ni/Al/Ni Multilayer Composites |
Author(s) |
Kuan-Chieh Hu, Jhe-Yu Lin |
On-Site Speaker (Planned) |
Kuan-Chieh Hu |
Abstract Scope |
Joining Ni and Al is challenging when conventional welding is employed due to their large disparities in melting point and density. Therefore, this study explored the weldability of Ni/Al/Ni lamellar composites by ultrasonic welding (USW), a solid-state bonding technique.
After USW, the peel test and interfacial microstructure were carried out by using universal tester, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS).
It is found that nano-scale intermetallic (IMC) layers with a thickness less than 200 nm were found at both Ni/Al interfaces. This nano-IMC layers positively influenced strength evolution, where the peel load peaked over 350 N with a fracture occurred at the base metal side, suggesting a successful bonding.
In the future, the composition of the IMC phase will be analyzed by using focused-ion beam (FIB) and transmission electron microscopy (TEM) to clarify the mechanism of interface formation further. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Characterization, Mechanical Properties |