| About this Abstract |
| Meeting |
6th World Congress on Integrated Computational Materials Engineering (ICME 2022)
|
| Symposium
|
6th World Congress on Integrated Computational Materials Engineering (ICME 2022)
|
| Presentation Title |
DAMASK - Experiences from 10 Years ICME Software Development for Physics-based ICME |
| Author(s) |
Martin Diehl, Pratheek Shanthraj, Philip Eisenlohr, Franz Roters, Dierk R. Raabe |
| On-Site Speaker (Planned) |
Martin Diehl |
| Abstract Scope |
Crystal plasticity modeling methods have evolved into one of the cornerstones of computational materials science and engineering. They combine the tensorial nature of the individual crystallographic shear modes such as carried by dislocations, martensitic transformations, shear bands or mechanical twins with the orientation dependence and polyphase structure of crystalline matter. With the Düsseldorf Advanced Material Simulation Kit (DAMASK) we aim to provide a modular and extensible framework for crystal plasticity simulations at various length scales. At the core of DAMASK is a flexible and hierarchically structured model of material point behavior for the solution of elastoplastic boundary value problems along with damage and thermal physics within a finite-strain continuum framework. This talks sketches implementation details of DAMASK, such as the staggered integration scheme for the material state, the coupling of different physical effects, and the integration into different solvers for boundary and initial value problems. Besides discussing the technical details of the current version, lessons learned from developing a modular simulation framework embedded into an ecosystem for pre- and post-processing are presented. To this end, the history of DAMASK – starting from a user subroutine for commercial FEM solvers to its transition into a stand-alone multiphysics framework is briefly outlined. Finally, several illustrative examples are given to demonstrate how DAMASK is used to understand the mechanical behavior of polycrystalline materials. |
| Proceedings Inclusion? |
Definite: Other |