About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Mechanical Behavior Related to Interface Physics IV
|
Presentation Title |
Confined Layer Slip Process in Ag/Cu Nanolaminates: An Atomistic Study |
Author(s) |
Mahshad Fani, Luis Cervantes, Anshu Raj, Shuozhi Xu |
On-Site Speaker (Planned) |
Mahshad Fani |
Abstract Scope |
Nanolaminates demonstrate remarkable strength because of their layered structures and their effect on dislocation dynamics. In this work, a confined layer slip process is investigated in nanolaminated Ag and two types of Ag/Cu nanolaminates. Using atomistic simulations, we investigate how interfacial structures and void size/position affect the edge dislocation glide within nanoscale layers. This study examines slip behavior in incoherent interfaces characterized by differing arrays of misfit dislocations. We determine how different glide planes react to dislocation motion, especially where intersection lines coincide with misfit dislocation lines. The study also examines how the introduction of voids may act as stress concentrators and alter the slip behavior and mechanical response of nanolaminates. These insights demonstrate the crucial role that interfacial structures and voids play in determining the mechanical properties of nanolaminated materials, providing valuable information for the design and optimization of nanolaminated materials for advanced technological applications. |
Proceedings Inclusion? |
Planned: |
Keywords |
Mechanical Properties, Modeling and Simulation, |