| Abstract Scope |
This study used selective laser melting (SLM) to manufacture a multi-functional Cu-Ni-Sn-P alloy and investigated the effect of homogenization and aging heat treatments on the microstructure, mechanical- and thermophysical-properties. Initial microstructural observation confirmed that the as-built alloy was composed of Cu, Cu<sub>6</sub>Sn<sub>5,</sub>, Cu<sub>3</sub>P and undissolved Ni phases. After the homogenization, the Cu-Ni-Sn alloy shows Cu-Ni solid-solution and (Cu,Ni)<sub>3</sub>P phases. On the other hands, elemental composition of Ni in (Cu,Ni)<sub>3</sub>P phase increased with increasing aging time. Vickers hardness measurements showed 69.6HV and 225.1HV in the homogenized alloy and 4H-aged alloy, respectively. Furthermore, compressive yield strengths of homogenized- and aged-sample showed same tendency with hardness, showing remarkable improvement in mechanical properties. Meanwhile, as aging time increased, thermal conductivity also increased about 26%. It is due to the decreasing frequency of lattice collision of electrons in solid-solution. Based on these findings, the optimum combination of mechanical- and thermophysical properties was also discussed. |