| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
D-17: Interfacial Reaction of Au-xAg/Al Couples |
| Author(s) |
Chiao-Yi Yang, Kuo-Jung Chen, Hsien-Ming Hsiao, Yee-Wen Yen |
| On-Site Speaker (Planned) |
Chiao-Yi Yang |
| Abstract Scope |
The Au/Al structure in the wire bonding technology is the most widely used and mature connection circuit in electronic assembly. In this study, various Au-xAg/Al couples were prepared and aged at 450°C. The results indicated that the AuAl2, Au2Al, and Au4Al phases were formed at the Au-25 wt.%Ag/Al interface. When the Ag content in the Au was increased to 30, 40, 50 and 75 wt.%., the Ag2Al, AuAl2, and Au4Al phases were formed at the interface. The total intermetallic compounds (IMCs) thickness was increased when the Ag content was increased. Meanwhile, when the Ag content was increased, the IMCs formation at the interface was changed from the Au-Al system to the Au-Ag and Au-Al systems. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |