| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Recycling and Sustainability in Cast Shop Technology: Joint Session with REWAS 2025
|
| Presentation Title |
Microstructure-Based Analysis of Bonding Mechanisms of Solid-State-Recycled Aluminum Chips for Sustainable Semi-Finished Products |
| Author(s) |
Alexander Koch, Frank Walther |
| On-Site Speaker (Planned) |
Alexander Koch |
| Abstract Scope |
In response to the imperative of climate change, the exploration of sustainable manufacturing processes has gained significant momentum. This study investigates the direct recycling of aluminum chips to fabricate semi-finished products, presenting an energy-efficient alternative to traditional re-melting methods. The novel process chain comprises briquetting, field-assisted sintering (FAST) for chip consolidation, and cold extrusion. Comparative analysis demonstrates a 70% improvement in quasi-static and cyclic properties using this diffusion-based chain compared to methods relying on high shear stresses and deformations. Detailed examinations of chip boundaries via light and scanning electron microscopy elucidate bonding mechanisms. The performance of the products is assessed through quasi-static and cyclic investigations, while microstructural mechanisms influencing hardening and softening behaviors are isolated using hardness measurements. Additionally, electrical resistance measurements differentiate the effects of various mechanisms. This integrated approach provides a detailed evaluation of the performance, offering a sustainable pathway of manufacturing in response to environmental challenges. |
| Proceedings Inclusion? |
Planned: Light Metals |