| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Electrical Current-Induced Phase Transformation and Enhanced Mechanical Properties in η'-Cu6Sn5 for Electronic Solder Joints |
| Author(s) |
Shubhayan Mukherjee, Shih-kang Lin |
| On-Site Speaker (Planned) |
Shubhayan Mukherjee |
| Abstract Scope |
Copper (Cu) is a key substrate material in electronic interconnections, and tin (Sn) is a primary component of solders. The intermetallic compound Cu6Sn5, forming at the Cu-Sn solder joint, critically influences joint properties and reliability. Cu6Sn5 has two allotropes: the hexagonal η phase and the monoclinic η’ phase, forming above and below the transition temperature of 186 ℃, respectively. This study examines the impact of electrical current on the mechanical and structural properties of η'-Cu6Sn5. The single-phase η'-Cu6Sn5 samples were exposed to different current densities, causing phase transitions. Synchrotron radiation-based XRD revealed crystallographic alterations. Micropillar compression tests using nanoindentation determined mechanical properties under high current density. These findings highlight significant structural and mechanical changes in η'-Cu6Sn5 due to electrical current stressing. Furthermore, the study examined the mechanical and structural properties of as-prepared η-Cu6Sn5 to comprehensively compare with the changes in η'-Cu6Sn5 under the influence of electrical current. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |