About this Abstract |
Meeting |
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
Symposium
|
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
Presentation Title |
Hygroscopicity of 3D Printed Carbon Fiber Reinforced Polymeric Composites |
Author(s) |
Isaac Wesley Sluder, Andrew Frankowski, Kwek Tze Tan |
On-Site Speaker (Planned) |
Isaac Wesley Sluder |
Abstract Scope |
3D printed prototypes and structures are often subjected to humid environments which can affect the mechanical properties of polymers. This study investigates the effect of humidity on the mechanical properties of two industrial grade nylon-based filaments reinforced with uniformly distributed chopped carbon fibers: Onyx, a PA6-based by Markforged, and PAHT-CF (Paht), a PA12-based by Bambu Labs. Motivation for this test arises from the introduction of Bambu Labs’ release of PAHT-CF claiming Paht has lower moisture absorption. This test aims to determine if Paht outperforms Onyx in resilience, despite Onyx's industrial popularity.
Specimens are printed using the Markforged Mark II for Onyx and the Bambu Labs X1E for Paht. They are conditioned in a humidity and temperature chamber at 55% RH and room temperature. The samples are removed from the chamber at two-week intervals over a two-month duration. At each interval, specimens are weighed and tested. Moisture content is calculated using weight change. Mechanical properties are determined using Flexural, Tensile and Impact results.
Paht is expected to have a higher resistance to humidity, due to its composition of PA12, compared to Onyx, which is composed of PA6. The hypothesis is that longer PA12 chain makes Paht more resilient to moisture absorption and reaches moisture absorption at a lower percentage than PA6. Generally, PA6 exhibits higher impact resistance compared to PA12. However, exposure to environmental elements may lead to deviations from this expectation. These findings help to encourage and advise the use of 3D printed parts in end use industrial applications. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |