| About this Abstract |
| Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
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| Symposium
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2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
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| Presentation Title |
Development of Multimaterial Additive Manufacturing Systems for the Embedded Electronics |
| Author(s) |
Carson Vath, Kazi Md Masum Billah, Guhaprasanna Manogharan |
| On-Site Speaker (Planned) |
Carson Vath |
| Abstract Scope |
Hybrid manufacturing for integrating different material systems/structures within additively manufactured structures is of growing interest to the AM community. Current wire deposition system in thermoplastic substrates uses thermal energy to embed the wire which in general leads to surface damage and loss the part integrity. This research develops a wire embedding tool that is designed to embed wire in a photocurable thermoset. Thermoset is relatively stable and does not require heat for implanting wire. This method will have relatively more rapid production rate as the extrusion process can be conducted without any interruptions.
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| Proceedings Inclusion? |
Definite: Post-meeting proceedings |