| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Chemistry and Physics of Interfaces
|
| Presentation Title |
Impact of Thermal Gradient on Interfacial Energy and its Anisotropy in Al-Cu Alloy |
| Author(s) |
Amrutdyuti Swamy, Pabitra Choudhury, Anthony Lavelle |
| On-Site Speaker (Planned) |
Amrutdyuti Swamy |
| Abstract Scope |
Additive manufacturing (AM) offers transformative potential but is limited by microscopic defects in metal parts during solidification. This study focuses on enhancing equiaxed grain formation in Al-Cu alloys, a key strategy to mitigate these defects. Using molecular dynamics simulations, we investigate the solid-melt interface of Al-Cu systems under varying Cu compositions and thermal gradients, simulating rapid solidification conditions. Building on prior research indicating that higher Cu content favors equiaxed grain growth, we introduce a thermal gradient to assess its combined effect with Cu composition on the resulting microstructure. We further analyze the evolution of interfacial free energy and anisotropy parameters in relation to the applied thermal gradient, contributing to a deeper understanding of microstructure control in AM of Al-Cu alloys. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Modeling and Simulation, Computational Materials Science & Engineering, Additive Manufacturing |