About this Abstract |
Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
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Symposium
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2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
Presentation Title |
Microstructure-Informed Thermal-Mechanical Simulation of Multi-Bead Structures for Large Area Additive Manufacturing Polymer Composite Extrusion/Deposition |
Author(s) |
Neshat Sayah, Aigbe Awenlimobor, Douglas E. Smith |
On-Site Speaker (Planned) |
Neshat Sayah |
Abstract Scope |
Large scale polymer extrusion/deposition has emerged as a preferred manufacturing technology for making large parts where carbon fiber filled materials are employed to reduce thermal expansion and increase strength and stiffness. This presentation simulates the thermal history and its effect on residual stress while printing multi-bead columns of carbon fiber ABS on a large scale additive manufacturing (LAAM) system. A finite element model is presented which uses element addition to include new bead layers during the process simulation. Bead geometries and void and fiber content throughout the beads are measured with microCT scanning where specific focus is given to computing the spatially varying thermal-mechanical properties from the bead microstructure. Results show the effect of bead position and surface convection on bead temperatures and stress. Bead adhesion calculations are also provided to expose the significant effect that bead microstructure has on bead interface temperature, stress, and degree of adhesion. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |