| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior Related to Interface Physics IV
|
| Presentation Title |
Tensile Failure of Epitaxial TiN/Cu/TiN Sandwich Pillar Structures |
| Author(s) |
X. Zhang, R. Namakian, D. Moldovan, Wen Jin Meng |
| On-Site Speaker (Planned) |
Wen Jin Meng |
| Abstract Scope |
A combined experimentation - molecular dynamics simulation study was conducted to understand tensile failure of TiN/Cu/TiN interfacial regions. Tensile loading was conducted on micro-pillar specimens fabricated from TiN/Cu/TiN thin film sandwich structures. The Cu layer and the TiN layer underneath were grown epitaxially on MgO(001) substrates. The Cu layer contains numerous nanotwins with the {111} twin planes parallel to the growth direction. Tensile loading in-situ a scanning electron microscope revealed a failure mode transition as the Cu layer thickness changes, from ductile tensile fracture occurring within the Cu layer to apparently brittle fracture occurring close to the Cu/TiN interface. The accompanying molecular dynamics simulations illustrate the film growth mechanism, and the impact of dislocation activities close to the interface on initiation of nanovoids, leading to eventual tensile fracture. The combined experimentation-simulation results offer an understanding of tensile failure mechanisms for ceramic/metal/ceramic interfacial regions. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Characterization, Modeling and Simulation |