| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
2024 Technical Division Student Poster Contest
|
| Presentation Title |
SPG-76: Stabilization of Dendritic Copper Wick Structure through a Two-step Electrodeposition Process |
| Author(s) |
Jie-Hau Liao, Chien-Neng Liao |
| On-Site Speaker (Planned) |
Jie-Hau Liao |
| Abstract Scope |
Dendritic copper wicks are frequently utilized in boiling heat transfer applications due to their micro- and nano-scaled bimodal porous structure. The structural stability of the copper wicks is crucial in determining boiling performance. This work introduces a two-step electrodeposition to enhance the structural stability and adhesion strength of the dendritic copper films. Both constant-current and pulsed-current electrodeposition methods were employed. A capillary rate-of-rise method was used to evaluate the capillary performance (K/Reff) of the dendritic copper wicks, while the adhesion of the film was evaluated by the ASTM D3330 tape peel test. The two-step electrodeposition was found to be advantageous in improving both the structural integrity and adhesion of the dendritic copper films. The prepared Cu films showed a significant 30% improvement in adhesion according to the tape peel test results. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Surface Modification and Coatings, Copper / Nickel / Cobalt, Mechanical Properties |