| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Comparison of Corrosion Resistance between Electroless and Electroplating Ni/Pd/Au Surface Finish on PCB |
| Author(s) |
Albert T. Wu, Yi-Ting Shen, Nico Li, Freeze Wang, Chih-Yuan Hsiao |
| On-Site Speaker (Planned) |
Albert T. Wu |
| Abstract Scope |
Corrosion resistance of electroplating Ni/Pd/Au is in comparison with electroless Ni/Pd/Au (ENEPIG) surface finishes. Both surface finishes were plated on Cu pad in automobile printed circuit board (PCB). Each layer and different combination of the double layers were also investigated to study the corrosion properties of the materials. The samples were placed in a chamber of 100% RH (relative humidity) and an ambient of 15 ,150 and 1500 ppm of SO2.The morphology of corrosion products formed on the surface were studied by scanning electron microscopy (SEM), and the elements of corrosion products were analyzed by energy dispersive X-ray spectroscopy (EDS). Grazing incident X-ray diffraction (GIXRD) was applied to characterize the crystal structure of the corrosion products. The results reveal that the electroplating Ni/Pd/Au has better corrosion resistance than the ENEPIG. A mechanism is proposed to discuss the corrosion behaviors for the surface finishes. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |