| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
2024 Technical Division Student Poster Contest
|
| Presentation Title |
SPG-9: Unraveling the Structural Dynamics of Cu6Sn5 Hexagonal Phase under Electrical Current Stressing |
| Author(s) |
Shubhayan Mukherjee, Shih-kang Lin |
| On-Site Speaker (Planned) |
Shubhayan Mukherjee |
| Abstract Scope |
In the realm of modern electronic packaging, the stability of materials faces challenges under high electric current density, primarily attributed to the accumulation of intermetallic compounds (IMCs) such as Cu6Sn5. This compound typically forms between Sn-based solders and Cu substrates, showcasing the ƞ phase above 186 °C and the monoclinic ƞ’ phase below this temperature. To bolster the reliability of microelectronic devices, a profound understanding of growth kinetics amid varying electrical current densities is crucial. This study focuses on analyzing the hexagonal ƞ-Cu6Sn5 phase in the presence of electrical current. We synthesized a single-phase hexagonal ƞ-Cu6Sn5 and scrutinized its morphology and crystal structure before and after the application of electrical current density, employing a self-designed sample stage. Through these investigations, we aim to unravel the phase stability and transition phenomena associated with the high-temperature hexagonal ƞ-Cu6Sn5 phase. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Other, Other, Other |