| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Comparison Between Current Induced Joule Heat Variation on Near Eutectic and Off Eutectic Sn-Bi Solder Joint Stability |
| Author(s) |
Tae-Kyu Lee, Pushkar Gothe, Yujin Park, Gnyaneshwar Ramakrishna, Young-Woo Lee, Hui-Joong Kim, Seul-Gi Lee, Choong-Un Kim |
| On-Site Speaker (Planned) |
Tae-Kyu Lee |
| Abstract Scope |
Low melting temperature solder material application in higher performance chips and network devices has several identified challenges. One of the challenges is the Bi segregation under current stressed solder joints. It is known that even a moderate current density can induce Bi segregation and induce instability in the solder joint either mechanically and electronically. Comparing to a near eutectic Sn-Bi solder alloy system, reducing the Bi content is expected to decrease or mitigate the Bi segregation. The presented study in this presentation identifies development of the joint microstructure changes under various current densities and the associated various joint joule heat condition. 300um solder joints with near eutectic Sn-Bi, and off eutectic Sn-Bi joints are current stressed up to 4000 A/cm^2 in various PCB test structure configurations, which generate different heat dissipation conditions. The long-term current stressed joint microstructure evolution per configuration and test conditions are analyzed and discussed. |
| Proceedings Inclusion? |
Planned: |