| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Micropillar Compression Test of Tin-solder Microstructural Units to Reveal Slip Activity |
| Author(s) |
Tianhong Gu, Finn Giuliani, Ben Britton |
| On-Site Speaker (Planned) |
Tianhong Gu |
| Abstract Scope |
We are interested in direct measurement of the microstructural components of tin-based solders, to provide inputs into phenomenological crystal plasticity models. Using focused ion beam machining, we have cut micropillars in high purity tin with specific crystal orientations. We explore the effect of strain rates, crystallographic orientations, and holding times on deformation mechanisms of β-Sn. Electron backscatter diffraction (EBSD) is used before and after compression to reveal the evolution of the crystallographic orientations and assist in resolving the stress state within the pillar. Imaging of the pillars before and after each test are used to resolve the slip activity, including the use of slip trace analysis and the potential for digital image correlation. Our data is being used to support a UK based integrated research programme of microstructure engineering during solder fabrication, local property extraction, and reliability modelling with crystal plasticity. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |