| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior Related to Interface Physics IV
|
| Presentation Title |
Characterization of interfacial bonding strength between 316 stainless steel and electrodeposited nickel layers via mesoscale mechanical testing |
| Author(s) |
Yuxin Hu, Sebastian Lam, Fei Teng, Peter Hosemann |
| On-Site Speaker (Planned) |
Yuxin Hu |
| Abstract Scope |
Electrodeposition is commonly used to add metal layers like Nickel or Copper to metals for protection or functionalization. The interfacial strength is a crucial quality factor for the coating’s adhesion to the substrate. However, traditional adhesive-based testing methods fail when bonding strength exceeds the adhesive bonding strength. While typical adhesive-free methods require a thick deposition before tests can be conducted, and scratch testing is only qualitative. Thus, there’s a need for mechanical testing methods for thin deposition layers with strong bonding. This study analyzed the bonding strength between 316 stainless steel substrate and electrodeposited nickel by mesoscale mechanical testing. Femtosecond laser machined tensile bars of 0.85mm length with the interface at the center were tensile tested with Digital Image Correlation (DIC). Further, different microstructure with altered deposition conditions was characterized. Results demonstrated strong bonding strength and indicated that the electrodeposited layers are able to dissipate stress in the substrate. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Surface Modification and Coatings, Other |