| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Annealing Effect on the Electro-recrystallization of Tin |
| Author(s) |
Wei-Cheng Meng, Kwang-Lung Lin |
| On-Site Speaker (Planned) |
Kwang-Lung Lin |
| Abstract Scope |
A solder joint experiences cyclic Joule heating and current stressing upon application. The Joule heating gives rise significant annealing effect to the solder interconnect. This work presents the effect of prior annealing on the behavior of Sn under cyclic current stressing at 6 x 103 A/cm2. The current stressing variables were 1~3 current stressing cycles and 0.5~2.5 h current stressing duration. Grain refining evidence the occurrence of electro-recrystallization of Sn under cyclic current stressing. The annealing temperature, 60 ~140oC, governed the recrystallization rate. Annealing at lower temperature achieved the finest grain size at shorter current stressing duration. The current stressing did not change grain orientation as evidenced by EBSD analysis, while produced dislocations as revealed by HRTEM analysis. The highest dislocation density was achieved at 1 cycle-0.5 h among all current stressing conditions. The recrystallization was attributed to the joint effect of dislocation and Joule heat. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Mechanical Properties, Other |