| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Si and Ag Particles Sintering Technology For Die Attach |
| Author(s) |
Minoru Ueshima, Motoharu Haga, Tomoaki Mototsuji, Yusuke Isono |
| On-Site Speaker (Planned) |
Minoru Ueshima |
| Abstract Scope |
Ag sintering technology is one of the best candidates for SiC die attach. However cracks propagates into SiC dies or DBC substrates in severe reliability tests because of the high strength and CTE of Silver. In this study, a method to coat Si particles with Ag layer and its sintering properties are researched. Si particles coated with Ag layer are prepared by utilizing high-speed 3D motion of a patented 3D Ball Mill producted by Nagao System Inc.. Their Si-Ag particles are mixed with a solvent to formulate into pastes. These pastes are printed onto Ag electroplated Cu plats, and then the bonding experiments are carried out at temperatures of 250℃ for 60 min without pressure at air atmosphere. It is revealed that some Ag layers are jointed on the surface of Si particles. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |