About this Abstract |
Meeting |
2020 TMS Annual Meeting & Exhibition
|
Symposium
|
Ultrafine-grained and Heterostructured Materials (UFGH XI)
|
Presentation Title |
Mechanical Properties and Residual Stress of Copper Processed using Ultrasonic-nanocrystalline Surface Modification |
Author(s) |
Hyoung Seop Kim, |
On-Site Speaker (Planned) |
Hyoung Seop Kim |
Abstract Scope |
Recently, a new surface SPD called the ultrasonic nanocrystalline surface modification (UNSM) technique has exhibited improved global mechanical properties as well surface properties of the processed material. Effects of surface grain refinement and residual stress on the local and global properties of pure Cu processed using ultrasonic nanocrystalline surface modification (UNSM) was investigated. To distinguish each contribution to the local hardness and global tensile properties of the UNSM treated Cu, a stress-relief specimen of the same microstructure as the UNSM treated one was produced by low-temperature annealing after the UNSM treatment. The distinct contributions of residual stress and surface grain refinement to the tensile property of UNSM treated Cu were determined and discussed. |
Proceedings Inclusion? |
Planned: Supplemental Proceedings volume; Planned: Supplemental Proceedings volume |
Keywords |
Advanced Processing, |